[f-castrillo]

Questions for the Crackberry faithful and DIYers!

I'm currently in the process of repairing my device from a botched bezel swap. Because of my carelessness, I snapped the ribbon responsible for the lock button functionality, and I may have unseated the camera in the disassembly process, evidenced by my phone intermittently and randomly not being able to start the camera.

Once my replacement lock ribbon arrives and I'm ready to install it, I was thinking of attempting a reflow of the camera using a heat gun.

1. is a reflow advisable, considering it will require exposure of sensitive camera components to a heat gun?

2. What temperature would allow the components to reflow, with minimal damage to the camera?

I just fixed my PS3 using the heat gun reflow method, and the idea occurred to me that it might work for the camera too. Thanks in advance!

Posted from my CrackBerry at wapforums.crackberry.com