Originally Posted by
CanadianThomas Mine has a slight bulge on the back, right at the logo/cpu. It did not have this when new.
I am tech support for a living and have been for a long time. Fixed so many iPads/iPhones/Computers and so on its sickening.
I chatted to RIM over this. They said the first Playbooks are completely flat but after a while the started to make them with the slightest bulge (way less than a mm) to facilitate better air flow over the CPU. If yours has a bulge and get hot under normal use it should be looked at, not fix by yourself.
If you have an early one (like me) that was flat and now isn't, it should be looked at by RIM. There could be thermal damage to the Logic Board from exceeding the thermal limit for the hardware.
Mine is going in to Rim in the morning, got the fedex box yesterday.
My professional advice to everyone is NOT TO DO THIS!. unless you are skilled and knowledgeable in the thermal limits of the hardware, the bulge should be reported to RIM.
In my personal experience, you will regret it later if its not dealt with properly.
Sorry OP, Just my opinion. Had to share.